Amazon Launches $15 Billion Bond Sale as AI Infrastructure Spending Surges

Written by toptechcompanies | Published 2025/11/18
Tech Story Tags: amazon | amazon-bond-sale | amazon-debt-offering | ai-infrastructure-spending | u.s.-dollar-bonds | corporate-bond-markets | amazon-multi-tranche-bond-sale | morgan-stanley-forecast

TLDRAmazon is returning to the U.S. bond market with a $15 billion, six-part offering to fuel AI-driven infrastructure expansion, drawing heavy investor demand and joining a wider wave of tech companies issuing debt to support soaring capital expenditures.via the TL;DR App

Amazon will raise $15 billion through its first U.S. dollar bond offering in three years, Reuters reported on November 17, citing a filing with the SEC. The issuance comes as major technology companies increase spending on infrastructure to support rising demand for artificial intelligence workloads.

According to the filing, Amazon launched a six-part bond sale on Monday. The company said proceeds may be used for acquisitions, capital expenditures, or share buybacks. Bloomberg News reported that demand for the bonds reached roughly $80 billion at its peak.

Bloomberg also reported that pricing for the longest portion of the offering, a 40-year bond, tightened to 0.85 percentage point above U.S. Treasuries after initial discussions at 1.15 percentage point.

The sale follows a wave of debt issuance across the technology sector. Last month, Meta Platforms announced plans for a bond sale of up to $30 billion. Oracle is also reportedly preparing to raise $15 billion in the debt market.

Morgan Stanley estimates that major technology firms, including Meta, Amazon, and Alphabet, are expected to spend about $400 billion on AI infrastructure this year. Amazon’s own capital expenditure is projected to reach about $125 billion in 2025, with further increases expected the following year.


Written by toptechcompanies | Who are the best tech companies around? We review websites, services, products, and more.
Published by HackerNoon on 2025/11/18